178 The 2023 Report on 3D Package-on-Package Semiconductor Packaging: World Market Segmentation by City
This study covers the world outlook for 3D package-on-package semiconductor packaging across more than 2,000 cities. For the year reported, estimates are given for the latent demand, or potential industry earnings (P.I.E.), for the city in question (in millions of U.S. dollars), the percent share the city is of the region, and of the globe. These comparative benchmarks allow the reader to quickly gauge a city vis-à-vis others. Using econometric […]