The research report on Embedded Non-Volatile Memory market projects industry estimates for next five years starting 2022 – 2027. The report focuses on different aspect have an impact on market. The report evaluates several factors determining the market expansion as well as the volume of the whole Embedded Non-Volatile Memory Market Report 2022 by Manufacturer, Region, Type and Application.
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The global Embedded Non-Volatile Memory market was valued at 616.81 Million USD in 2021 and will grow with a CAGR of 17.37% from 2021 to 2027, based on HNY Research newly published report.
The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).
Embedded non-volatile memory (eNVM) has become an important and essential IP that adds flexibility to electronic products and helps accelerate time-to-market. UMC offers state-of-the-art embedded non-volatile solutions to meet a variety of embedded system applications. High quality embedded non-volatile memories (eFuse, eOTP, eMTP, eE2 PROM and eFlash) can be used for trimming, redundancy, data encryption, ID, coding and programming.The market growth is attributed to the increasing penetration of IoT-based devices and services in the developing countries. The need for ubiquitous connectivity necessitates rapid deployment of inexpensive and low power consuming products with the ability to communicate securely. Therefore, proliferation of IoT-based devices and services is estimated to spur the demand significantly over the forecast period. Embedded non-volatile memory is a small-sized chip used to meet a variety of embedded system applications. It is primarily used in smart card, SIM card, microcontrollers, PMIC, and display driver IC for the purpose of data encryption, programming, trimming, identification, coding, and redundancy. Manufacturers focus on providing secured eNVMs for MCUs used in the IoT-based devices. High efficiency and compact design associated with eNVMs is expected to replace comparatively bulky, conventional, standalone non-volatile memories. It is one of the key components of IoT-based microcontroller devices. Use of low power and low-cost embedded non-volatile memories can decrease the consumer electronics cost significantly, which is also anticipated to catapult product demand over the next few years. The growing need for security in connected device is anticipated to provide avenues for growth owing to the secured layer provided at the most vulnerable physical layer, which cannot be breached through passive, semi-invasive, and invasive methods. These memories are also used in automobiles, particularly in head-up displays and next generation technology such as key-less push button start features. Therefore, increasing demand for smart cars is anticipated to catalyze eNVM market growth over the next eight years.Miniaturization of devices such as smartphones as well as automobile components has instigated manufacturers to reduce the process node size without affecting the performance. For instance, Chinese manufacturer, HHGrace is investing in R&D, in order to scale down the process node to deliver compact and efficiently performing eNVM solutions, PWM ICs, and MEMS chips. Significant and lasting barriers make entry into this market difficult. These barriers include, but are not limited to: (i) product development costs; (ii) capital requirements; (iii) intellectual property rights; (iv) regulatory requirement; and (v) Transitions` unfair methods of competition. Despite the presence of competition problems, due to the global recovery trend is clear, investors are still optimistic about this area, the future will still have more new investment enter the field. Even so, the market is intensely competitive .The study group recommends the new entrants just having money but without technical advantage and upstream and downstream support do not to enter into this field.
By Market Verdors:
TSMC
GlobalFoundries
UMC
SMIC
Samsung
HHGrace
TowerJazz
Microchip Technology
Fujitsu
By Types:
200mm Fabs
300mm Fabs
By Applications:
Consumer Electronics
IoT
Telecommunications
Automotive
Key Indicators Analysed
Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
Market Trends: Market key trends which include Increased Competition and Continuous Innovations.
Opportunities and Drivers: Identifying the Growing Demands and New Technology
Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.
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